General properties of diamond

Property

Value

Units

Hardness

10,000

kg/mm²

Strength, tensile

>1.2

Gpa

Strength, compressive

>110

Gpa

Fracture strength

400–800

MPa at < 1 mm thickness

Sound velocity

18,000

m/sec

Density

3.52

g/cm³

Young's modulus

1200

GPa

Poisson's ratio

0.2

Dimensionless

Atomic density

1.77 x 10²³

atoms/cm³

Thermal expansion coefficient

1.1–5.0 (300-1300K)

ppm/K

Thermal conductivity

10–20

W/cm-K

Thermal shock parameter

30,000,000

W/m

Coefficient of friction

0.05 (dry)

Dimensionless

Derbyetemperature

2,200

K

Optical index of refraction (at (591 nm)

2.41

Dimensionless

Opticaltransmissivityrange

225 to far IR

nm

Emissivity

0.02–0.03

at 10 microns

Optical absorption coefficient

0.05–0.3

at 10 microns

Loss tangent at 40 Hz

0.0006

Dimensionless

Loss tangent at 140 GHz

<10^-5

Dimensionless

Dielectric constant

5.7

Dimensionless

Dielectric strength

10,000,000

V/cm

Electron mobility

2,200

cm²/V-sec

Hole mobility

1,600

cm²/V-sec

Electron saturated velocity

27,000,000

cm/sec

Hole saturated velocity

10,000,000

cm/sec

Work function

small and negative

On [111] surface

Bandgap

5.45

eV

Resistivity

10¹³ - 10¹⁶

Ohm-cm

Thermal properties of diamond and other electronic materials

Material

Thermal conductivity
W/cm/°K

Thermal expansion coefficient
x 10^-6/°K

CVD diamond

10–18

1.5

Silver

4.1

19

Copper

3.9

17

Beryllia

2.5

6.4

CuW/90/10

1.7

6.5

Aluminum nitride

1.7

4.6

Alumina

0.25

8

Silicon

1.5

4.1

GaAs

0.44

6.5